塑料微流控芯片热压及键合设备结构设计研究  

The mechanism design of hot embossing and bonding machine for polymer microfludic chips fabrication

作　　者：王钧[1] 王晓东[1] 刘冲[1] 

机构地区：[1]大连理工大学机械工程学院,大连116024

出　　处：《机械设计与制造》2004年第4期93-95,共3页Machinery Design & Manufacture

基　　金：国家863重大项目资助(2002AA404460)

摘　　要：微通道的热压成形及盖片与基片的键合是制作塑料微流控芯片的关键工艺。大连理工大学微系统研究中心开发了用于自动化制作塑料微流控芯片的设备。该设备采用封闭的立柱结构,通过力矩电机驱动的螺旋升降机提供所需的压力。对其结构设计进行研究,具体介绍该设备结构设计的特点。The hot embossing replication of microchannels' on polymer and the bonding are two key technics for plastic microfludic chips fabrication. Research center for Micro system technology(MST) of DUT(Dalian University of Technology) has developed new hot embossing and bonding machine which can automatically fabricate plastic microfludic chips. The machine adopts closed frame, electromotion handspide for generating pressing force and force motor etc. The mechanism of the developed machine is studied and the design characteristic introduced.

关 键 词：塑料微流控芯片 热压成形及键合设备 结构设计 

分 类 号：TH6[机械工程—机械制造及自动化]