机电产品拆卸研究综述  

DISASSEMBLY OF MECHANICAL AND ELECTR(ON)IC PRODUCTS: THE STATE-OF-ARTS

作　　者：高建刚[1] 武英[1] 向东[1] 刘学平[1] 段广洪[1] 汪劲松[1] 

机构地区：[1]清华大学精密仪器与机械学系,北京100084

出　　处：《机械工程学报》2004年第7期1-9,19,共10页Journal of Mechanical Engineering

基　　金：国家自然科学基金(59935120);国家863计划项目基(2002AA421240)资助项目。

摘　　要：拆卸是绿色制造系统的重要组成部分,是实现节约资源、保护环境和制造业可持续发展的重要手段。收集、整理和研究了国内外大量有关机电产品拆卸方面的科研与实践成果,总结了面向拆卸的设计、拆卸过程规划、拆卸技术与工具和拆卸系统配置等4个方面的研究现状,并提出有待进一步研究和开发的若干问题。As an important part of Green Manufacturing, dis-assembly is a way to save natural resource, to protect environ-ment and to realize sustainable development of manufacturing industry. By collection, classification and study of the achieve-ments on disassembly of mechanical and eletr(on)ic products, the state-of-arts of design for disassembly, disassembly process planning, disassembly technology and tools, and disassembly system configuration are presented. Several problems on disas-sembly that need be further studied and developed are also dis-cussed.

关 键 词：面向拆卸的设计 拆卸过程规划 拆卸技术 拆卸工具 拆卸系统配置 

分 类 号：TH122[机械工程—机械设计及理论]