中温固化单组分耐热胶粘剂的固化和分解行为的红外分析  

IR analysis of curing and decomposability of one component middle temperature curing heat-resistant adhesive

作　　者：王超[1] 黄玉东[1] 李丽[2] 刘文彬[3] 

机构地区：[1]哈尔滨工业大学理学院 [2]黑龙江大学化学化工与材料学院,黑龙江哈尔滨150080 [3]哈尔滨工程大学化学系,黑龙江哈尔滨150001

出　　处：《黑龙江大学自然科学学报》2004年第3期123-126,共4页Journal of Natural Science of Heilongjiang University

摘　　要：研究了一种由有机硅改性酚醛树脂,有机硅改性石棉,混炼丁腈橡胶为主要成分的单组分中温固化瞬间耐热700℃用于碳/碳复合材料粘接胶粘剂。其固化和热分解行为的红外光谱分析表明:胶粘剂的固化主要是酚醛树脂中羟甲基缩合作用,高温条件下首先是胶粘剂中的混炼丁腈橡胶分解,在升温过程中,有机硅改性酚醛树脂与有机硅改性石棉中的有机硅发生缩合形成无机/有机杂化结构,随着温度升高,无机/有机杂化胶粘剂中非耐热基团分解,但骨架结构保留,在更高温度下,酚醛树脂中的苯环开始分解,而胶粘剂尚有一定强度,但在700-900℃,胶粘剂已经变成无机硅酸盐。IR spectra analysis of curing and decomposability course of one component middle temperature curing heat-resistant adhesive is studied. The adhesive consists of polyphenylmenthylsiloxan modification phenolic resin, polyphenylmenthylsiloxan modification asbestos, mixing NBR and curing accelerator, which can be used at 700℃ for instant. The curing groups of the adhesive depend on hydroxymethly of polyphenylmenthylsiloxan modification phenolic resin. At high temperature, NBR and other unheat-resistant groups decompose at first, then benzene group. At very high temperature, such as 800-900℃ the adhesive has changed into inorganic silicate, which indicates that the adhesive has good heat-resistant property.

关 键 词：红外光谱 固化 分解 

分 类 号：V255.4[一般工业技术—材料科学与工程]