镀钯技术及工艺研究  

Study on Technology of Palladium Plating

作　　者：曹人平[1] 肖士民[1] 

机构地区：[1]华南理工大学应用化学系,广东广州510641

出　　处：《表面技术》2004年第5期50-51,共2页Surface Technology

摘　　要：　为了适应现代电子、光学及装饰等领域的需要,采用正交试验法研究了镀钯新技术及工艺,研究了镀液成分和工艺条件对镀层的影响。概述了镀钯液的配制和维护,并介绍了镀钯过程中的注意事项。利用本工艺电镀能得到性能优良的钯镀层,如外观白亮、反光率高、接触电阻小、硬度高、耐磨、耐蚀等优点。In order to fit modern requirement in electronic, optical and functional field, the study on technology of palladium plating according to orthogonal test and effects of both components and plating parameters on properties of palladium and electrolyte are introduced. In addition, preparation and maintenance of palladium electrolyte are described. It has good properties of palladium coating, such as bright surface , high glisten rate , low contact resistance , high rigidity, antifriction, anticorrosion and so on.

关 键 词：镀钯 电镀液 工艺研究 

分 类 号：TQ153.1[化学工程—电化学工业]