镀铑工艺研究  

Rhodium Plating Technology

作　　者：曹人平[1] 肖士民[1] 

机构地区：[1]华南理工大学应用化学系,广东广州510641

出　　处：《材料保护》2004年第9期23-24,共2页Materials Protection

摘　　要：为了适应现代电子光学及装饰等领域的需要 ,根据侯氏槽法和正交试验法研究了镀铑新技术及工艺 ,探讨了镀液中成分及工艺条件对镀液和镀层的影响 ,并对其镀液和镀层的性能进行了测试。此外 ,概述了镀铑液的配制和维护 ,并介绍了镀铑过程中的注意事项。利用本工艺电镀能得到性能优良的铑镀层 ,如外观白亮、反光率高、接触电阻小、硬度高。In order to meet the modern requirement of electronic,optical and decorative function,new rhodium plating technology was studied according to Hou-shi bath and orthogonal tests.Effects of bath componetns and plating parameters on properties of rhodium electrolyte and plating were investigated,and the properties of rhodium electrolyte and plating were investigated,and the properties of rhodium electrolyte and plating were examined.In addition,the preparation and maintenance of rhodium electrolyte were described and the precautions in rhodium plating were introduced.Rhodium plating obtained by the technology has excellent properties as bright surface,high reflection,low contact resistance,high hardness,and wear and corrosion resistance.

关 键 词：铑 电镀 工艺研究 

分 类 号：TQ153.1[化学工程—电化学工业]