电子器件冷却用重力型热管散热器的实验研究  

Experimental Study on Thermosyphon Heat Sink for Cooling of Electronic Apparatus

作　　者：王雪峰[1] 孙志坚[1] 吴存真[1] 靳静[1] 王立新[1] 

机构地区：[1]浙江大学机械与能源工程学院,杭州310027

出　　处：《电子器件》2004年第3期393-396,共4页Chinese Journal of Electron Devices

摘　　要：用发热铜块模拟电子器件 ,油泵回路控制风温 ,毕托管和倾斜式微压计测量风速等方法 ,建立了热管型散热器性能测试系统。对所设计的重力型热管电子器件散热器 ,通过改变散热功率、风速、风温等因素来测试电子器件表面温度的变化。实验结果表明 :重力型热管散热器具有良好的散热性能 ,可满足较高热流密度 (小于 8.5 6× 1 0 4 w/m2 )电子器件的冷却要求。性能测试系统具有良好的精度和可靠性 。Based on the methods of simulating electronic apparatus with a heating copper block, controlling wind temperature with an oil pump loop and measuring wind velocity with a pitot tube and an inclined micro-manometer etc, a performance test system of thermosyphon heat sink was set up. The system tests the temperature on the surface of electronic apparatus for a thermosyphon heat sink by changing heat sink's power, wind velocity and wind temperature. Research conclusions show this new thermosyphon heat sink has a good performance and can meet the cooling require of high thermal current density(<8.56×10~4 w/m^2) of electronic apparatus. With its excellent precision and reliability, the performance test system provides an important means for improvement design of thermosyphon heat sink.

关 键 词：重力型热管 电子器件冷却 散热器 

分 类 号：TN305.94[电子电信—物理电子学]