以电解法制备的次磷酸镍和次磷酸进行化学镀镍  

ELECTROLESS NICKEL PLATING USING NICKELHYPOPHOSPHITE AND HYPOPHOSPHOROUS ACIDPREPARED BY ELECTROLYSIS

作　　者：王福生[1] 韩晓丽[1] 宋兵魁[1] 刘英华[1] 张宝贵[1] 

机构地区：[1]南开大学环境科学与工程学院,天津300071

出　　处：《南开大学学报（自然科学版）》2004年第3期78-81,共4页Acta Scientiarum Naturalium Universitatis Nankaiensis

摘　　要：采用四室电渗析槽,以镍板为阳极,不锈钢为阴极,次磷酸钠为原料,电解法制得次磷酸镍和次磷酸溶液,并且用该溶液配制化学镀镍液,进行了化学镀镍的研究.该镀液寿命长,得到的镀层光亮、致密,耐腐蚀性高,粘结性好.In this paper, hypophosphorous acid and nickel hypophosphite solution was prepared by electrolytic process with four compartments electrodialytic cell, nickel as anode, stainless steel as cathode and sodium hypophosphite as raw material. Electroless nickel plating directlyusing the former solution was studied. The bath have a long-lifetime, the film received have shiny compact appearance, high corrosion resistance and great adhesion.

关 键 词：电解法 次磷酸镍 化学镀镍 

分 类 号：TQ153.1[化学工程—电化学工业]