镍-碳化硅纳米复合电铸层的制备  

Preparation of Compound Electroplate Layer of Nano Ni-SiC Particulate

作　　者：张文峰[1] 朱荻[1] 薛玉君[1] 赵飞[1] 

机构地区：[1]南京航空航天大学

出　　处：《特种铸造及有色合金》2004年第5期9-11,共3页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目 (50 0 750 4 0 );国防基础研究基金资助项目 (J1 50 0E0 0 2 )

摘　　要：在应用电铸技术制备Ni SiC纳米复合材料的工艺中 ,分析了当镀液pH值、温度以及搅拌速度一定时 ,镀液中纳米SiC颗粒悬浮量和阴极电流密度对Ni SiC复合电铸层中纳米SiC复合量和电铸速率的影响。用SEM对纳米复合电铸层的表面形貌和组织成分进行了分析 ,同时探讨了纳米复合电铸层中SiC颗粒复合量对其显微硬度的影响。结果表明 ,Ni SiC纳米复合电铸层表面光滑平整 ,显微组织均匀、致密 ,显微硬度较纯镍镀层有明显提高。Effects of the amoutnt of suspending nano-SiC particulate and cathode current density in the electrolyte on nano-SiC particulate amount and electrolyte rate in Ni-SiC compound electrolyte layer were analyzed at a given pH value, temperature and stirring speed for nano-Ni-SiC composite preparation. The surface morphology and structural constituent in the electrolyte layer were observed by SEM. Effects of nano-SiC particulate amount in compound electrolyte layer on the micro-hardness were approached. The results showed that the nano Ni-SiC plating layer possessed smooth and even surface, uniform and sound microstructure as well as higher micro-hardness than single Ni plating layer.

关 键 词：纳米复合电铸层 表面形貌 显微硬度 

分 类 号：TB383[一般工业技术—材料科学与工程]