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作 者:张俊苓[1] 郑文杰[1] 杨芳[1] 白燕[1] 李毅群[1]
出 处:《暨南大学学报(自然科学与医学版)》2004年第5期596-599,共4页Journal of Jinan University(Natural Science & Medicine Edition)
基 金:国家自然科学基金资助项目(20271022);广东省自然科学基金资助项目(010369)
摘 要: 研究了具有平面环状共轭体系的硫杂环化合物噻吩羧酸在金表面的自组装单分子膜及其修饰金电极的电化学行为.以Fe(CN)4-/3-6为"探针"离子,用循环伏安法对自组装膜的形成、电极界面电容及其组装机理进行了研究.结果是噻吩羧酸在Au上的覆盖度约为95%,金电极的界面微分充电电容由修饰前的0 294μF/cm2下降到0 167μF/cm2,由此可见噻吩羧酸在金表面形成了致密的单分子膜.The self-assembly monolayer of thiophene-2-carboxylic acid with plane-conjugated system on gold surface were obtained and electrochemical behavior of the modified electrode was studied. By the means of cyclic voltammetry with Fe(CN)^(4-/3-)6 as probe, the formation of the monolayer, electrode interfacial capacitance and their assembly mechanism were investigated. The monolayer's surface coverage approximately was 95%. The electrode interfacial differential capacitance was reduced from 0.294 μF/cm^2 to 0.167 μF/cm^2. The results indicated that the self-assembly monolayer of thiophene-2-carboxylic acid on gold surface was densely and steadily formed.
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