聚酰亚胺/纳米二氧化硅复合薄膜的结构和电学性能研究  

Study on structure and electric properties of the polyimide/nano-silica film

作　　者：张明艳[1] 衷敬和[1] 吴宝华[1] 范勇[1] 雷清泉[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,黑龙江哈尔滨150040

出　　处：《绝缘材料》2004年第5期1-3,6,共4页Insulating Materials

基　　金：国家自然科学基金重点项目资助(50137010)。

摘　　要：在聚酰胺酸的二甲基乙酰胺溶液中,采用甲基三乙氧基硅烷为前驱体,水解原位产生二氧化硅纳米粒子的溶胶—凝胶工艺,制备了聚酰亚胺／纳米二氧化硅复合薄膜。采用红外光谱对薄膜进行了表征,并对薄膜的介电常数、介质损耗和体积电阻率随二氧化硅含量变化进行了分析和讨论。结果表明,二氧化硅的含量在10～15%之间,介电常数、介质损耗和体积电阻率达到最大值并与纯聚酰亚胺薄膜的性能提高;二氧化硅含量进一步增加性能下降并比纯聚酰亚胺薄膜的性能有所下降,加入偶联剂能在适当提高二氧化硅含量下提高薄膜的性能。In this paper,a kind of nano-hybrid polyimide/silica films were prepared through sol-gel reaction by the hydrolysis and condensation of methyl-triethoxysilane which produced the nano-silica in-situ in the polyamic acid solution.The chemical structure of the films was characterized by Fourier transform infrared spectroscope;Changes of dielectric constantε,dielecˉtric loss tantδand volume resistivityρv with silica content were studied.The results showed that there were maximum values ofε,tantδandρ v when silica content was between10%and15%,which were higher than those of pure polyimide film.After that,with silica content increasingε,tantδandρ v decreased.And coupling agent would increase dielectric properties of the films under slightly higher SiO 2 content.

关 键 词：聚酰亚胺薄膜 纳米二氧化硅 复合 

分 类 号：TM215.3[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]