树形分子键合剂与HMX的相互作用  

Interaction between HMX and Dendritic Bonding Agent

作　　者：潘碧峰[1] 罗运军[1] 谭惠民[1] 

机构地区：[1]北京理工大学材料科学与工程学院,北京100081

出　　处：《火炸药学报》2004年第3期25-28,共4页Chinese Journal of Explosives & Propellants

摘　　要：通过使用显微红外光谱(MIR)和X射线光电子能谱(XPS)技术,研究了树形分子键合剂(DBA)对HMX晶体的粘附性能及其界面相互作用机理。实验表明,树形分子键合剂可以与HMX分子的-NO2基团形成诱导效应,-CN含量高的DBA分子对HMX具有较好的粘附性能,从而为开发HMX晶体的有效键合剂提供理论指导。A dendritic bonding agent (DBA) that can adhere to HMX filler is successfully reported. The coating properties are characterized by Micro infrared and X-ray photoelectron spectroscopy (XPS). The adhesive degree can be up to 100% from XPS analysis, the adhesive degree increases by increasing of CN group content. The results indicate that H-bond and induction effect are formed between DBA and -NO_2 groups. So DBA is proved to be a kind of valid bonding agent for HMX.

关 键 词：树形分子键合剂 HMX NEPE推进剂 

分 类 号：TQ564[化学工程—炸药化工] O643[理学—物理化学]