正硅酸乙酯对有机无机杂化膜结合强度的影响  

Influence of tetraethoxysilanes (TEOS) on the interfacial bond strength between organic-inorganic hybrid film and substrate

作　　者：张兴文[1] 胡立江[1] 赵树山[2] 孙德智[3] 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001 [2]哈尔滨工业大学航天科学与力学系,黑龙江哈尔滨150001 [3]哈尔滨工业大学环境科学与工程系,黑龙江哈尔滨150001

出　　处：《哈尔滨工业大学学报》2004年第10期1344-1346,1350,共4页Journal of Harbin Institute of Technology

基　　金：黑龙江省科技重点国际技术合作项目 (WB0 2 10 4);黑龙江省科技重点攻关资助项目 (GB1A2 0 60 ) ;哈尔滨工业大学跨学科交叉性研究基金资助项目 (HIT .MD2 0 0 2 0 5 )

摘　　要：采用溶胶 -凝胶法水解缩合 3-缩水甘油醚基丙基三甲基硅烷 (GPMS)和正硅酸乙酯 (TEOS) ,制备了TEOS改性的 3-缩水甘油醚基丙基倍半硅氧烷 ,用凝胶渗透色谱GPC进行了表征和确认 ,浸渍法使其在玻璃基体上成膜 .用划痕法通过MTSNanoIndenterXP纳米压痕仪测试了有机 -无机杂化膜的结合强度和划痕形貌 ,测试结果表明 :适当添加TEOS可提高有机 -无机杂化膜的膜基结合强度 ,W(TEOS) 15Epoxy-silsesquioxanes derived from hydrolytic condensation of (3-glycidoxypropyl) trimethoxysilane (GPMS) and tetraethoxysilane (TEOS) were prepared by sol-gel process. The thin films were coated on glass substrates by the dip-coating method. The products were characterized by gel partition chromatography (GPC). The nano-scratch method was used to determine the interfacial bond strength and the scratching micrograph by means of MTS Nano Indenter XP. The result showed that appropriate TEOS content in the hybrid films could improve the interfacial adhesion and bond strength. The hybrid film contained 15% TEOS exhibited the maximum interfacial bond strength.

关 键 词：结合强度 有机-无机杂化膜 纳米划痕 正硅酸乙酯 

分 类 号：TQ314.2[化学工程—高聚物工业]