酸性镀铜研究进展  

Advance in Research of Acidic Copper Electroplating

作　　者：刘烈炜[1] 吴曲勇[1] 卢波兰[1] 杨志强[2] 

机构地区：[1]华中科技大学化学系,湖北武汉430074 [2]武汉材料保护研究所,湖北武汉430030

出　　处：《电镀与精饰》2004年第5期13-17,共5页Plating & Finishing

摘　　要：将至今所使用的酸性镀铜添加剂分成六类进行了归纳叙述;简述近年来的各种物理因素例如脉冲技术、超声波技术、激光技术等在酸性镀铜中的应用现状及其对镀层质量的影响;总结应用阴极极化曲线、交流阻抗、微分电容等测试方法研究添加剂电化学行为和用扫描电镜、X-射线衍射、原子力显微镜等研究镀层结构来探讨酸性镀铜的沉积机理的一般方法。Additives used in acidic copper electroplating are reviewed in six categories. Present situation of application of modern physical techiques such as pulse current technique, ultrasonic technique, laser technique in acidic copper electroplating and their effect on the copper coating quality are briefly described. The application of polarization curve, AC impedance, differential capacity test methods to research the electrochemical behavior of additives and the application of SEM, XRD, AFM techniques to investigate the grain structure and surface morphology of copper electrodeposit are summarized. These techniques and test methods are used to probe into the mechanism of the effect of additives and copper deposition in acidic copper electroplating.

关 键 词：酸性镀铜 镀层质量 阴极极化 沉积机理 添加剂 镀层结构 X-射线衍射 微分 电化学行为 原子力显微镜 

分 类 号：TG174[金属学及工艺—金属表面处理] TQ153[金属学及工艺—金属学]