部分熔化处理工艺对(Bi,Pb)-2223/Ag带材相组成和微结构的影响  

Effect of the Partial Melting Process on the Phase Assemblage and Microstructure of the (Bi,Pb)-2223/Ag Strip

作　　者：刘育松[1] 张平祥[2] 李成山[2] 于泽铭[2] 郑会玲[2] 熊晓梅[2] 刘奉生[2] 姜冰[1] 梁明[2] 冯勇[2] 周廉[2] 

机构地区：[1]东北大学,辽宁沈阳110006 [2]西北有色金属研究院,陕西西安710016

出　　处：《稀有金属材料与工程》2004年第9期984-987,共4页Rare Metal Materials and Engineering

基　　金：国家"973"基础研究项目"Bi系带材基础性研究"(G199906-46-05)

摘　　要：通过部分熔化处理工艺和普通两段热处理工艺的对比研究,分析了部分熔化处理工艺在不同热处理阶段对(Bi,Pb)-2223/Ag带材相组成和微结构的影响。实验结果显示,在熔化温度下,部分(Bi,Pb)-2212相发生分解,分解为(Sr,Ca)2CuO3相、(Sr,Ca)Cu2O3相和富(Bi,Pb)液相,与此同时(Sr,Ca)2CuO3相和(Sr,Ca)Cu2O3相快速长大。随着冷却和成相处理,(Sr,Ca)2CuO3相和(Sr,Ca)Cu2O3相长大到一定尺寸,各相系统达到平衡后,就不再长大,并和部分液相反应,重新生成具有良好取向的(Bi,Pb)-2212相。在成相处理阶段,(Bi,Pb)-2212相转化为(Bi,Pb)-2223相,同时生成的(Bi,Pb)-2223相继承了(Bi,Pb)-2212相的良好取向,使(Bi,Pb)-2223相织构得以改善,致密度得到提高,结果最终带材的性能得到提高。通过部分熔化处理工艺处理的带材Ic达到51A,而普通两段热处理工艺处理的带材Ic为36A,Ic提高了约40%。The effect of different stages of the partial melting process on the phase component and microstructure of (Bi,Pb)-2223/Ag strip was analyzed and compared to the normal two-stage heat treatment process. The results show that some of the (Bi,Pb)-2212 phase melted and decomposed into (Sr,Ca)(2)CuO3, (Sr,Ca)Cu2O3 and rich (Bi,Pb) liquid phase. At the same time, the (Sr,Ca)(2)CuO3 and (Sr,Ca)Cu2O3 phases grew rapidly. During cooling and phase formation, the (Sr,Ca)(2)CuO3 and (Sr,Ca)Cu2O3 phases stop growing when they reach a certain size and react with liquid phase to recreate the (Bi,Pb)-2212 phase with good orientation. At the phase formation stages, the (Bi,Pb)-2223 phase during transformation from the (Bi,Pb)-2212 phase inherits the good orientation of (Bi,Pb)-2212 phase. This results in an improvement in the texture and the density of the (Bi,Pb)-2223 phase which in turn results in an improvement of the critical current. The final strip made by the partial melting process has a critical current of 51 A (while the strip made by the normal two-stage heat treatment process have the lower critical current of 36 A). Thus the new method increases the critical current by about 40%.

关 键 词：部分熔化 相组成 (Bi Pb)-2223/Ag 

分 类 号：TG156[金属学及工艺—热处理]