脉冲复合电镀(Ni-P)-纳米微粒SiO_2工艺  

A Study of the Technology of (Ni-P)-nanometer SiO_2 Composite Pulse Electroplating

作　　者：曹铁华[1] 成旦红[1] 桑付明[2] 袁蓉[1] 徐伟一[1] 

机构地区：[1]上海大学环境与化学工程学院,上海200072 [2]上海大学理学院,上海200436

出　　处：《电镀与精饰》2004年第6期27-30,共4页Plating & Finishing

摘　　要：采用脉冲电流,制备(Ni-P)-纳米SiO2复合镀层。通过正交试验设计的方法,重点考察了脉冲平均电流密度、脉宽、占空比、搅拌方式及纳米SiO2的添加量对镀层沉积速率、镀层硬度以及镀层中SiO2质量分数的影响,从而遴选出最佳的电镀工艺。同时,对脉冲电镀与直流电镀进行了比较。By the method of pulse electroplating, (Ni-P)-nanometer SiO_2 composite coating was prepared. The effects of process conditions such as average current density, pulse width, duty-cycle, stirring style and quantity of nanometer SiO_2 on deposition rate, hardness and quantity of SiO_2 in coating were studied through orthogonal experiments and the technology of electroplating was optimized. Meantime the pulse plating was compared with the direct current process.

关 键 词：NI-P 复合电镀 纳米SiO2 脉冲电镀 电镀工艺 镀层硬度 复合镀层 脉冲电流 沉积速率 纳米微粒 

分 类 号：TG174.4[金属学及工艺—金属表面处理] TQ153[金属学及工艺—金属学]