激光微熔覆柔性布线系统研究及应用  

Study of Laser Micro-Cladding System to Circuit Boards Fabrication

作　　者：李祥友[1] 李耀兵[1] 刘冬生[1] 曾晓雁[1] 

机构地区：[1]华中科技大学激光技术国家重点实验室,武汉430074

出　　处：《应用激光》2004年第5期258-260,共3页Applied Laser

基　　金：国家自然科学基金项目(50075030); 国家"863"项目(2001AA421290)

摘　　要：介绍了一种利用激光制备线路板的新方法———激光微熔覆柔性布线技术 ,根据其原理和特点 ,设计并制造了相应的柔性布线系统 ,重点介绍了其软硬件组成。最后 。A novel method to fabricate circuit board by laser micro-cladding technology was introduced in this paper. According to its characteristics, the laser direct fabrication system was designed and manufactured. Corresponding hardware and software were described in detail. Finally, some applications of this system were presented.

关 键 词：线路板 布线技术 激光 熔覆 软硬件 布线系统 柔性 设计 实例 

分 类 号：TN24[电子电信—物理电子学] TP393[自动化与计算机技术—计算机应用技术]