镀金表面微孔腐蚀的电接触特点  

The Electric Contact Properties of Pore Corrosion on Gold Plated Surface

作　　者：李雪清[1] 章继高[1] 

机构地区：[1]北京邮电大学自动化学院,北京100876

出　　处：《电工技术学报》2004年第9期51-56,共6页Transactions of China Electrotechnical Society

摘　　要：镀金接触材料表面容易出现微孔。由于湿度、腐蚀性气体及尘土颗粒的影响,镀层表面在微孔处形成腐蚀,降低了连接器的可靠性。通过对长期室内自然暴露的薄镀金样片表面的形貌、腐蚀状况以及成分分析,同时对腐蚀表面不同位置处的直流接触电阻、高频接触阻抗进行测试,从而全面分析表面微孔腐蚀对电接触性能的影响。Plating defects known as pores are unavoidable in most noble metal plating thicknesses used in separable electrical contact applications. With the effects of humidity, corrosive gas and dust particles in the air, pore corrosion contaminant appears on the pore site on plating surface and the connector reliability is lowered. To examine the effects of corroded pores to the electric contact behavior, the surface morphology, chemical composition and physical appearance of the corroded pores are examined. The pore sites on which corrosion products are observed as the core products surrounding by some corrosion rings were examined under optical microscope and SEM. Dust particles are also deposited on gold plating during indoor air exposure.The contact resistance is found changing from outside point to inside point through the stain area, and the values are much higher than normal in the whole stain area. And the contact impedance changed with the sample surface corrosion situation of contact spots and signal frequency. The contact resistance became high and unstable due to the corrosion and when the corrosive products stacked seriously, the contact capacitance should be the domain affect parameter.

关 键 词：镀金 电接触 微孔 微孔腐蚀 

分 类 号：TM503.5[电气工程—电器]