柔性接头用低模量硅橡胶配方及界面粘接技术研究  

Research on low modulus silicon rubber formula and interface adhesion technology for flexible joints

作　　者：李胜华[1] 何永祝[1] 张劲松[1] 凌玲[1] 

机构地区：[1]中国航天科技集团公司四院四十二所,襄樊441003

出　　处：《固体火箭技术》2004年第3期201-203,共3页Journal of Solid Rocket Technology

摘　　要：研究了硫化剂、增粘剂和补强填料等组分对一种低模量、低硬度和高强度的硅橡胶配方力学性能的影响规律,同时研究了一种胶粘剂配方来满足硅橡胶与金属钢界面粘接的工艺要求。该硅橡胶配方的剪切模量小于0.3MPa,与钢界面粘接的剪切强度大于2.5MPa,满足柔性接头部件的性能要求。The effects of the constituents such as curing agent, tackifier and reinforcement filler on mechanical property of a sort of silicon rubber formula with low modulus, low rigidity and high strength were studied. To meet the technical requirement of the interface adhesion between silicon rubber/steel, a kind of adhesive formula was developed. The shear modulus of silicon rubber formula is less than 0.3 MPa, and the shear strength of interface adhesion between silicon-rubber and steel is greater than 2.5 MPa. So the formula can meet the property requirement of flexible joint.

关 键 词：硅橡胶 低模量 配方 接技 硫化剂 补强填料 增粘剂 界面粘接 金属 高强度 

分 类 号：V555.2[航空宇航科学与技术—人机与环境工程] TQ333.93[化学工程—橡胶工业]