TiN颗粒增强铜基复合材料的制备及性能研究  被引量:14

Fabrication and Properties of TiN Particle-Reinforced Copper Matrix Composites

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作  者:刘德宝[1] 崔春翔[1] 

机构地区:[1]河北工业大学材料学院,天津300293

出  处:《稀有金属》2004年第5期856-861,共6页Chinese Journal of Rare Metals

基  金:国家自然科学基金资助项目 ( 5 0 2 710 2 4) ;河北省自然科学基金资助项目 ( 5 0 10 13 )

摘  要:采用粉末冶金法制备了不同颗粒含量的TiNp/Cu系列复合材料。研究了TiNp 对TiNp/Cu复合材料的硬度、屈服强度、导电性能及摩擦磨损性能的影响 ,并与相同制备工艺所制备的纯铜及WCp/Cu复合材料的性能作了比较。针对粉末冶金法制备的复合材料 ,对已有的电导率理论计算模型进行了修正。结果表明 :TiNp/Cu复合材料的硬度、屈服强度、摩擦磨损性能明显优于纯铜 ,导电性能与相同体积分数的WCp/Cu复合材料相近 ,而摩擦磨损性能优于相同体积分数的WCp/Cu复合材料 ,TiNp/Cu是一种具有良好应用前景的新型功能材料。TiN p/Cu composites with different particle contents were fabricated by powder metallurgy. The effect of TiN p on the hardness, yield strength, electrical conductivity and wear properties of TiN p/Cu composites were studied. Pure copper and WC p/Cu composites were fabricated by same fabrication processing to compare with the properties of TiN p/Cu composites. The present theoretical models for predicting the electrical resistivity of composites were modified for the composites fabricated by powder metallurgy. As a results, the hardness, yield strength and wear-resistance of TiN p/Cu composites are much better than the pure copper. TiN p/Cu composites and WC p/Cu composites with same particle volume fractions have near electrical conductivities. TiN p/Cu composites exhibit better wear-resistance than the WC p/Cu composites. TiN p/Cu composite is a new functional materials with great application potential.

关 键 词:TIN 铜基复合材料 制备与性能 导电模型 

分 类 号:TG135.6[一般工业技术—材料科学与工程]

 

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