Ni-SiC纳米复合电镀工艺的研究  

A Study of Ni-SiC Nano-Composite Plating Process

作　　者：张文峰[1] 朱荻[1] 薛玉君[1] 赵飞[1] 

机构地区：[1]南京航空航天大学机电学院,江苏南京210016

出　　处：《电镀与环保》2004年第4期10-13,共4页Electroplating & Pollution Control

基　　金：国家自然科学基金资助项目 ( 5 0 0 75 0 40 )

摘　　要：分析了镀液中纳米SiC悬浮量、阴极电流密度、镀液 pH值、温度以及搅拌速度对复合沉积层中纳米SiC复合量和共沉积速率的影响 ,同时用正交实验法优选了各工艺参数 ,并且对Ni SiC纳米复合镀层进行了表面形貌和能谱分析。结果表明 ,Ni SiC纳米复合镀层表面平整光滑 ,显微组织均匀、致密 ,并且 ,其显微硬度也较纯镍镀层有明显提高。The effects of SiC concentration in electrolyte, cathodic current density, stirring rate, pH value and temperature on SiC content in Ni-SiC nano-composite coating and codeposition rate are analyzed. The optimized process parameters are obtained by orthogonal test, and the surface morphology and energy spectrum of the Ni-SiC nano-composite coating are also analyzed. The results show that the Ni-SiC nano-composite coating has a flat morphology and compact microstructure, and its micro-hardness is remarkably improved as compared with that of pure nickel coating.

关 键 词：NI-SIC 纳米复合电镀工艺 复合电沉积技术 复合镀层 SEM 

分 类 号：TQ153[化学工程—电化学工业] TB383[一般工业技术—材料科学与工程]