厚膜焊区Au-Pt导体浆料(英文)  

Thick-film Au-Pt Conductive Paste Used as Soldered Area

作　　者：俞守耕[1] 刘婀娜[1] 张晓明[1] 

机构地区：[1]昆明贵金属研究所,云南昆明650221

出　　处：《贵金属》2004年第4期26-30,共5页Precious Metals

摘　　要：用聚乙烯醇作分散剂,抗坏血酸作还原剂,将氯金酸还原到Au;以水合肼作还原剂,将氯铂酸盐还原到Pt,分别制备了Au粉和Pt粉;Au、Pt粉的平均尺寸分别为0.55μm和≈0.08μm。用氧化物和硼硅酸盐作粘结剂配制了1种玻璃粘结、3种混合粘结的浆料。浆料性能测量结果表明,一种性能较好的浆料有:拉伸强度>20N/mm2,烧结后收缩≤0.003mm,片电阻率≤40mΩ/□/25μm,30次浸锡后的溶蚀量为0.062～0.087mm。CuO溶入玻璃改善了化学键,从而提高了附着力。By using polyvinyl alcohol as disperse agent, Au- and Pt powders were prepared respectively by reduction of chlorauric acid to Au with ascorbic acid and reduction of chloroplatinate to Pt with hydrazine. Average size was 0.55μm for Au- and ≈0.08μm for Pt powder. One glass-, three mixed bonded pastes with Au/Pt ratio of 78/22 were formulated with oxides and borosilicates as binders. The measurement showed that the properties of a better paste were: tensile strength of >20N/mm2, shrinkage after firing of ≤0.003mm, sheet resistivity of ≤40mΩ/□/25μm, and leached amount of 0.062~0.087 mm after dipping 30 times. CuO dissolved into the glass improving chemical bond, consequently, increasing the adhesion.

关 键 词：硼硅酸盐 水合肼 浆料性能 还原剂 氯铂酸 分散剂 附着力 抗坏血酸 配制 混合 

分 类 号：TG174.451[金属学及工艺—金属表面处理] TS103.846[金属学及工艺—金属学]