Au-Ag-Si钎料合金的初步研究  

A Primary Study of the Au-Ag-Si Solder

作　　者：莫文剑[1] 王志法[1] 王海山[1] 杨会娟[1] 

机构地区：[1]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《贵金属》2004年第4期45-51,共7页Precious Metals

基　　金：国家高新工程重点项目(DZ-2002-021)

摘　　要：针对目前熔点在450～500℃范围内的电子器件用钎料的空缺,通过分析Au-Ag-Si系三元相图,并根据其存在的共晶单变量线e1e2,制备了几种熔化温度在400～500℃的共晶钎料合金,并对其钎焊性和加工性能进行了初步的研究。DTA分析发现,合金的熔点在所选定的合金成分范围内随Ag含量的增加而升高。此钎料与Ni板浸润性较好;将钎料合金铸锭热轧后表明该合金作为可加工的实用钎料是合适的。同时,初步探讨了Cu元素对于Au-Ag-Si系合金的熔化特性和塑性变形能力的影响,结果表明Cu对于改善合金的加工性能和缩小固液相间距具有重要的意义。Aiming at the lack of solder melted at 450～500℃ for jointing electronic apparatus, according to the analyses of Au-Ag-Si phase diagram, and basing on the eutectic line e1e2, the eutectic alloys with melting temperatures of 400～500℃ were introduced, and the wettability and ability in plastic deformation of alloys were studied. It was shown that this alloy’s melting point would be risen with the increase of Ag content, the Au-Ag-Si solder alloy had a good wettability to Ni, and that it can be processed into sheets. The effects of Cu on the ability in plastic deformation and melting characterization of this alloy were discussed primarily. The results indicated that Cu has important significance to improve the processing ability and shorten the interval between solidus and liquidus of this alloy.

关 键 词：钎料 合金 共晶 塑性变形能 钎焊性 加工性能 热轧 可加工 熔点 三元相图 

分 类 号：TG425[金属学及工艺—焊接] TG454