高强度、高电导率铜基合金材料的研究现状及发展  

Present Status and Development of Cu-based Alloy with High Strength and High Conductivity

作　　者：徐洪辉[1] 杜勇[1] 陈海林[1] 潘竹[1] 熊伟[1] 

机构地区：[1]中南大学粉末冶金国家重点实验室,长沙410083

出　　处：《材料导报》2004年第10期37-40,共4页Materials Reports

摘　　要：对高强度、高电导率铜基合金的研究现状进行了综述。经时效沉淀强化的合金显微组织结构好,强化效率高;快速凝固技术的运用可以大幅度地提高沉淀元素在Cu中的固溶度值,从而使铜基合金在电导率不显著降低的条件下,强度大幅度提高。近年来,国内外对原位加工的铜基复合材料MMCs进行了大量的研究工作,但在合金的最佳组成和实用化生产工艺方面还有待作更多和更深入的研究。The present status of Cu-based alloys with high strength and high conductivity is reviewed. The microstructures of the alloys strengthened by aging hardening are fine, and the strengthening efficiency is high. By means of rapid solidification technique, the solid solubilities of precipitated elements in Cu can be remarkably increased, and therefore the strength of Cu-based alloys is substantially raised without steep reduction of conductivity. In a recent decade, much research work has been done world-widely on the in situ processed Cu-based composites. But much more and deeper investigations are to be performed on the optimum composition and practical manufacture process of the alloys. Cu-based alloy,high strength,high conductivity,microstructure

关 键 词：铜基合金 高电导率 沉淀强化 快速凝固技术 高强度 固溶度 时效 研究现状 MMC 显微组织结构 

分 类 号：TB333[一般工业技术—材料科学与工程] TG146.11[金属学及工艺—金属材料]