Plasma spray forming of tungsten coatings on copper electrodes  

作　　者：蒋显亮 F.Gitzhofer M.I.Boulos 

机构地区：[1]School of Materials Science and Engineering, Central South University, Changsha 410083, China [2]Plasma Technology Research Center, University of Sherbrooke, Sherbrooke, J1K 2R1, Canada

出　　处：《中国有色金属学会会刊：英文版》2004年第5期835-839,共5页Transactions of Nonferrous Metals Society of China

摘　　要：Both direct current dc plasma and radio frequency induction plasma were used to deposit tungsten coatings on copper electrodes. Fine tungsten powder with mean particle size of 5 μm and coarse tungsten powder with particle size in the range from 45 μm to 75 μm were used as plasma spray feedstock. It is found that dc plasma is only applicable to spray the fine tungsten powder and induction plasma can be used to spray both the coarse powder and the fine powder. The tungsten coating deposited by the induction plasma spraying of the coarse powder is extremely dense. Such a coating with an interlocking structure and an integral interface with the copper substrate demonstrates high cohesion strength and adhesion strength.Both direct current dc plasma and radio frequency induction plasma were used to deposit tungsten coatings on copper electrodes. Fine tungsten powder with mean particle size of 5 μm and coarse tungsten powder with particle size in the range from 45 μm to 75 μm were used as plasma spray feedstock. It is found that dc plasma is only applicable to spray the fine tungsten powder and induction plasma can be used to spray both the coarse powder and the fine powder. The tungsten coating deposited by the induction plasma spraying of the coarse powder is extremely dense. Such a coating with an interlocking structure and an integral interface with the copper substrate demonstrates high cohesion strength and adhesion strength.

关 键 词：等离子喷涂 钨 铜电解工艺 联锁结构 金属 

分 类 号：TG174.444[金属学及工艺—金属表面处理]