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机构地区:[1]中国工程物理研究院化工材料所,四川绵阳621900 [2]大连理工大学化工学院高分子材料系,辽宁大连116012
出 处:《粘接》2004年第6期10-11,40,共3页Adhesion
摘 要:以低分子质量含二氮杂萘酮结构环氧树脂与环氧树脂E44配合作为胶粘剂基料,低分子聚酰胺(H-4)为固化剂,试制了一种在常温及中温下都有较好粘接性能的环氧胶粘剂。当配方为m(E44):m(ER):m(H-4)=4;4:9时,在180℃下固化3 h后,测其常温下的拉伸剪切强度为17.65 MPa,80℃下为19.71 MPa。并研究了固化工艺对粘接性能的影响。A low molecular weight epoxy resin containing phthalazinone (ER) and an epoxy resin E-44 were used as the matrix resin, and a low molecular weight polyamide (H-4) as the curing agent. By orthogonal experiments, a bettered composite w(E-44) : w(ER) : w(H-4)=4 : 4 : 9 was obtained, its shear strengths were 17. 65MPa at room temperature and 19. 71MPa at 80℃ when cured at 180 ℃ for 3hr . Increasing of curing time and curing temperature would enhance its shear strength. When the epoxy resin adhesive containing phthalazinone was dipping in different solvents, their shear strengths would maintained normally except in N, N-dimethyl acetamide.
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