脉冲电沉积超细晶粒Ni-Mn合金的显微硬度  

Study on Microhardness of Pulse Electrodeposited Ultrafine Grain Ni-Mn Alloy

作　　者：杨建明[1] 朱荻[2] 曲宁松[2] 

机构地区：[1]淮海工学院机械工程系,江苏连云港222005 [2]南京航空航天大学机电学院,江苏南京210016

出　　处：《表面技术》2004年第6期40-42,共3页Surface Technology

基　　金：国家自然科学基金资助项目(50075040);国防预研基金资助项目(J1500E002)

摘　　要：　利用冲液装置和高频窄脉宽脉冲电流,开展了Ni Mn合金的电沉积试验,得到的沉积层具有接近或达到纳米级的超细晶粒。对电沉积所得到的试片进行了显微硬度测试,研究与分析了电沉积工艺条件对沉积层显微硬度的影响。结果表明,电沉积工艺条件通过影响沉积层的锰含量和晶粒大小而影响沉积层的显微硬度。The electrodeposition of Ni-Mn alloy is carried out by using the device with flushing electrolyte and the pulse current with high frequency. The ultrafine grained deposits, which the grain sizes are close to or down to the order of nanometer, are obtained. The effects of deposition conditions on microhardness of the deposits are studied by means of microhardness tests. It is shown that the deposition conditions influence microhardness by varying Mn content and the grain size of the deposits.

关 键 词：电沉积 Ni-Mn合金 显微硬度 脉冲电流 

分 类 号：TQ153.2[化学工程—电化学工业]