纳米Cu-Al_2O_3复合材料的烧结法制备研究  

Study of Hot-press Sintering Process of Nanometer Cu-Al_2O_3 Composite

作　　者：王疆[1] 郦剑[1] 凌国平[1] 刘涛[2] 

机构地区：[1]浙江大学材料科学与工程系,浙江杭州310027 [2]中南大学粉末冶金研究院新技术所,湖南长沙410083

出　　处：《材料科学与工程学报》2004年第6期893-895,共3页Journal of Materials Science and Engineering

基　　金：国家高技术研究发展计划 (863计划 )资助项目(2 0 0 2AA332 1 0 0 )

摘　　要：研究了纳米Al2 O3陶瓷颗粒增强铜基复合材料制备技术。选用纳米级Al2 O3陶瓷颗粒作为增强相 ,采用超声波增强化学镀的方法完成对纳米Al2 O3陶瓷颗粒金属铜包覆 ,热压烧结成纳米Al2 O3陶瓷颗粒增强铜基复合材料 ,开采用XRD、TEM等分析测试技术对其组织性能进行研究。The processing technic was studied that the nanometer Al 2O 3 ceramic particles was used to reinforce copper-matrix composite.The particles were coated with copper by electrolessplating enhanced and dispersed with ultrasonic wave.The composite samples were prepared by hot-press sintering process.The microstructure and properties of composite samples were explored with transmission electron microscope (TEM) and X-ray diffraction(XRD).

关 键 词：增强相 纳米AL2O3 制备研究 化学镀 纳米级 包覆 陶瓷颗粒 铜基复合材料 AL2O3陶瓷 金属铜 

分 类 号：TQ174[化学工程—陶瓷工业] TB333[化学工程—硅酸盐工业]