化学置换镀铜研究进展  

Chemical Replacement Copper Plating

作　　者：刘烈炜[1] 卢波兰[1] 吴曲勇[1] 杨志强[2] 付承华[1] 

机构地区：[1]华中科技大学化学系,湖北武汉430074 [2]武汉材料保护研究所,湖北武汉430030

出　　处：《材料保护》2004年第12期36-38,共3页Materials Protection

摘　　要：置换镀铜的技术已经研究了许多年 ,但至今仍未在工业上取得有价值的应用 ,特别是化学置换镀铜层在铁基和锌基表面上作为电镀的底层的要求 ,其关键技术上仍未彻底地解决。回顾了近 10年来置换镀铜的历史 ,总结了几种较为重要的理论模型和实际工艺 ,并对使用情况作了说明。提出了对化学浸铜添加剂今后的研究方向 。Although the chem- ical replacement copper plating technology has been researched for many years, it has not got valuable industrial application as yet. Because there still exist several crucial technical problems, especially as the important basic copper plating on Fe Or Zn metal surface. The development history of chemical replacement copper plating was reviewed, and several more important mechanisms and technical processes of immersion plating copper were de- scribed. The application situations of above processes were also commented. At last, some possible chemical additive that could be used in the future were presented.

关 键 词：化学置换镀铜 添加剂 结合力 

分 类 号：TG174[金属学及工艺—金属表面处理]