极板放置方式对电铸层中微米/纳米SiC复合量影响的研究  

Study on Position of Electrode-plates Based on the Effect of SiC Content in Ni-SiC Electroforming Deposits

作　　者：张文峰[1] 朱荻[1] 

机构地区：[1]南京航空航天大学机电学院

出　　处：《中国机械工程》2004年第24期2241-2244,2251,共5页China Mechanical Engineering

基　　金：国家自然科学基金资助项目 (5 0 0 75 0 40 ) ;国防基础研究基金资助项目 (J15 0 0E0 0 2 )

摘　　要：在分析固体颗粒自身重力对复合电铸过程影响的基础上 ,就极板放置方式对复合电铸层中微米颗粒和纳米颗粒复合量的影响进行了研究。用SEM测定了两种复合电铸层的表面形貌并进行了表面能谱分析 ,探讨了间歇搅拌对复合共沉积过程的影响。研究表明 ,极板放置方式和间歇搅拌对提高微米颗粒在复合电铸层中的复合量有一定程度的影响 ,而对提高纳米颗粒在复合电铸层中的复合量影响甚微。Based on analyses of the influence of particle gravitation on the composite electroforming, the effects of position of electrode-plates on SiC content in Ni-SiC electroforming deposits were studied respectively. The surface morphology and energy spectrum of electroforming deposits were observed by SEM,and the effects of intermittent mixing on composite electrodeposition were discussed. Results show that the effects of position of electrode-plates and intermittent mixing on increasing SiC content in micro-composite electroforming deposit are obvious, and the effect on increasing SiC content in nano-composite electroforming deposit is not obvious.

关 键 词：复合电铸 极板放置方式 复合量 表面形貌 

分 类 号：TG174.44[金属学及工艺—金属表面处理]