冷却速度对SiC_p/2024Al热残余应力影响的数值模拟  

Numerical Simulation of Effect of Cooling Rate on Thermal Residual Stress in SiC_p/AI Composites

作　　者：李凤珍[1] 韩媛媛[2] 章德铭[2] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,黑龙江哈尔滨150040 [2]哈尔滨工业大学复合材料与结构研究所,黑龙江哈尔滨150001

出　　处：《哈尔滨理工大学学报》2004年第6期64-68,共5页Journal of Harbin University of Science and Technology

摘　　要：针对冷却速度对SiCp／2024Al复合材料热残余应力的影响,通过复合材料显微组织观察,根据复合材料的形貌特征,建立了平面应力状态的复合材料组织模型,利用有限元方法对SiCp/2024Al复合材料淬火和退火过程的热应力进行了数值模拟.结果表明,由于SiC增强颗粒与铝基体之间的热膨胀系数差异较大,热处理后颗粒和基体的界面附近产生很大的热残余应力场,同时基体发生塑性应变;冷却速度对复合材料热残余应力没有明显影响。The effect of the cooling rate on the thermal residual stress in the SiCP/2024Al composites was investigated. A model of composites under plane stress was established by the micrograph of the composites. Thermal stress of SiCp/2024Al composites during water quenching and annealing was numerically simulated by FEM. The result showed that there was great thermal stress field near the particle - matrix interface during heat treatment due to different thermal expansion between reinforced particle and Al matrix. There was also plastic strain in the matrix in the same time. The cooling rate was found to have no significant influence on the thermal residual stress in composites.

关 键 词：颗粒增强铝基复合材料 热残余应力 有限元分析 

分 类 号：TG146[一般工业技术—材料科学与工程]