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机构地区:[1]广东风华高新科技股份有限公司,广东肇庆526020
出 处:《电子元件与材料》2004年第12期32-35,共4页Electronic Components And Materials
摘 要:为了满足多层片式瓷介电容器MLCC小型化、大容量和低成本方向发展的要求,基于国内外对多层片式瓷介电容器以贱金属取代钯银体系作为电极的研究及应用,研究了以Ni为内外电极的BME-MLCC 的制作工艺,对工艺中排胶、烧成、烧端等关键工艺作了机理性探讨。通过选取电极材料、气氛控制和温度控制等,对以Ni为内外电极的多层片式瓷介电容器的制作工艺已经成功在实验室得到验证。Corresponding to the development of MLCC (Multi-layered Ceramic Capacitor) with small size, high capacity and low cost, basing on the fundamental researches and applications with base metals replacing the system of palladium-silver being used as electrode, manufactory process of base metal electrode multi-layered ceramic capacitor, with Ni Inner and termination electrode was studied. The key processes BBO, sintering, and termination firing were investigated. Through to select the electrode material, ambience control and temperature control etc, to succeeded to get the verification in the laboratory to manufactory technology of BME-MLCC with Ni inner and termination electrode.
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