金表面的清洗方法与电化学表征  

Cleaning and Electrochemistry Characterization of Gold Surface

作　　者：冯春梁[1] 李言[1] 佟永纯[2] 

机构地区：[1]辽宁师范大学化学化工学院,辽宁大连116029 [2]西北师范大学化学化工学院,甘肃兰州730000

出　　处：《辽宁师范大学学报（自然科学版）》2004年第4期440-443,共4页Journal of Liaoning Normal University:Natural Science Edition

基　　金：辽宁省教育厅资助项目(210144)

摘　　要：金被广泛应用于自组装膜的基底,金表面的清洗是完美自组装膜形成的关键技术.分别利用硫酸 过氧化氢(Piranha)洗液法和电化学清洗法对金表面进行了清洁处理,并利用循环伏安法对其进行了表征.结果表明:2种清洗方法可以达到相同的清洗效果,但前者具有强氧化性,不能用于环氧树脂封装的电极的清洗,而后者可以很好地解决这一问题,是一种电极表面清洗的有效方法.最后讨论了电解液中含有氯离子时对电极的腐蚀作用,进而给出了进行电化学清洗的条件.Gold is widely applied to the substrate of self-assembled technology. The cleaning of gold surface is the key to forming the self-assembled monolayer. The two methods of cleaning the surface of gold electrode, piranha solution and electrochemical cleaning, were studied by cyclic voltammetry. The results showed that the two methods are able to reach the same effects. But the electrochemical cleaning has the advantage of cleaning the electrode sealed up with epoxy resin. That is an effective method to clean the electrodes. The corrosion of chlorine ion had also been discussed, and the best conditions were declared.

关 键 词：自组装膜 电化学表征 循环伏安法 电极表面 表征 基底 过氧化氢 环氧树脂 硫酸 清洗 

分 类 号：TQ426.99[化学工程] O646[理学—物理化学]