Al/SiC_p陶瓷基复合材料伪半固态触变成形  

Al/SiC_p Ceramic Matrix Composites Thixoforming in Pseudo-semi-solid State

作　　者：罗守靖[1] 程远胜[1] 杜之明[1] 

机构地区：[1]哈尔滨工业大学

出　　处：《特种铸造及有色合金》2005年第1期13-15,共3页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目 (50 3750 35)

摘　　要：在粉末冶金的基础上 ,结合半固态金属加工技术和陶瓷成形的发展 ,提出陶瓷基复合材料伪半固态触变成形工艺并且以SiCp为基体 ,Al[φ(Al) =3 0 % ]为增塑相 ,通过该工艺成形卫星角框架制件。结果表明 ,该工艺成形的零件微观组织比较均匀 ,HV可达 6.43GPa ,应变ε约为 0 .5 % ,抗拉强度约为 3 0 0MPa ,为陶瓷复合材料以及高熔点材料在更多领域中的应用起到推进作用。A new forming method,the ceramic matrix composites thixoforming in pseudo-semi-solid state,was presented based on the powder metallurgy in combination with the semi-solid metal forming and the developing direction of the ceramic forming in the 21st century. The angle-frames were produced by the method with SiC p as the matrix materials and 30Al as the plasticization phase.The results show that the component' microstructure with 6.43 GPa Hv and about 0.5% strain stress as well as about 300 MPa tesile strength is homogeneously formed. It will play a very important role in promoting the application of the ceramic matrix composites and high melt point materials in more fields.

关 键 词：粉末冶金 伪半固态 触变成形 SICP 复合材料 

分 类 号：TB333[一般工业技术—材料科学与工程] TG376[金属学及工艺—金属压力加工]