导电介质填充聚合物分散工艺的模拟及研究  

Simulation and Study on the Dispersion Process of Conductive Particles Filled Polymer

作　　者：孟雅新[1] 刘长海[1] 熊传胜[1] 

机构地区：[1]西北核技术研究所,陕西西安710024

出　　处：《塑料科技》2005年第1期19-22,共4页Plastics Science and Technology

摘　　要：模拟了导电介质填充聚合物体系的二维点阵逾渗过程 ,研究了分散工艺对导电性复合材料逾渗形成过程的影响 ,以及HDPE/CB复合体系导电粒子的分布状态对其逾渗网络及导电特性的影响。根据在低填充体积分数时逾渗的发生是粒子不均匀分散这一原理 ,阐述了PTC材料设计制作的注意事项。It simulated the percolation process in 2-dimention lattice of conductive particles filled polymer, and studied the influencing effects of dispersion process on the percolation process of the conductive composites and the effects of the distribution state of conductive particles in HDPE/CB composites on its percolation network and conductive behavior. It also elaborated the key points of designing and producing the PTC material, which based on the principle of the percolation process resulted from the uneven dispersion of conductive particles in case of the volume fraction of the conductive particles was low.

关 键 词：填充 逾渗 聚合物 HDPE CB 分散 模拟 PIE 影响 导电介质 

分 类 号：TQ317[化学工程—高聚物工业]