PTC片式元件注凝成型工艺的研究  

Study of gelcasting of PTC chip thermistors

作　　者：周东祥[1] 郑志平[1] 龚树萍[1] 胡云香[1] 

机构地区：[1]华中科技大学电子科学与技术系,湖北武汉430074

出　　处：《华中科技大学学报（自然科学版）》2005年第1期34-37,共4页Journal of Huazhong University of Science and Technology(Natural Science Edition)

基　　金：国家高技术研究发展计划资助项目 (2 0 0 1AA32 5 0 4 0 ) .

摘　　要：研究了注凝成型工艺在制备BaTiO3 基PTC片式元件方面的应用 ,成功制备了高固相含量低粘度的BaTiO3 基陶瓷浆料 ,讨论了注凝成型过程中的影响因素 ,考察了注凝成型生坯和陶瓷元件的微观结构及陶瓷元件的PTC性能 ,制备出了室温电阻在 3～ 5Ω、温度系数为 18%～ 19%、升阻比大于 5的PTC片式元件 .注凝成型所得PTC片式元件的电性能稍优于轧膜成型所得样品的电性能 .Gelcasting was used for the fabrication of PTC chip thermistors. BaTiO 3 based ceramic slurries with high solid loading and low viscosity were prepared and the influential factors in the gelcasting process were analyzed. The microstructures of green tapes and PTC chip thermistors were investigated, and the electric characteristics of PTC chip thermistors studied. The results indicates that the PTC chip thermistors possess room resistance of 3～5?Ω, positive temperature coefficient of resistance 18?%～19?% and the ratios of maximum and minimum resistivity larger than 5. Compared with samples prepared by roll forming, the PTC chip thermistors prepared by gelcasting has better electric performance.

关 键 词：注凝成型 BaTiO3基陶瓷 PTC片式元件 

分 类 号：TQ174[化学工程—陶瓷工业]