贮氢合金表面置换镀铜工艺及电化学性能研究  

Process Optimization of Replacement Copper Plating for Hydrogen Storing Alloy and Its Electrochemical Behavior

作　　者：项民[1] 夏同驰[2] 张琦[1] 

机构地区：[1]北京航空航天大学材料学院应用化学系,北京100083 [2]郑州轻工业学院材料与化工学院,河南郑州450002

出　　处：《材料保护》2005年第1期30-33,共4页Materials Protection

摘　　要：为了提高MH -Ni电池负极贮氢合金电极的电化学性能 ,同时降低生产成本 ,减少污染 ,采用表面置换镀铜技术对贮氢合金粉末进行表面处理。通过循环伏安曲线、交流阻抗、放电曲线的测试 ,系统研究了 pH值、Cu2 + 用量、添加剂含量等工艺条件对贮氢合金电化学性能的影响。确定了置换镀铜最佳工艺条件为 :每处理 1g贮氢合金 ,需 0 .0 1mol/LH2 SO4 酸洗液 2 5mL ,Cu2 + 的加入量为 0 .0 5 g ,CuSO4 溶液的 pH值 1.5～ 2 .0 ,添加剂A的浓度为 12mg/L。结果表明 ,通过控制适宜的工艺条件可获得均匀、细致、光亮的置换镀铜贮氢合金 。Replacement copper plating was performed to modify the surface of the hydrogen storing alloy powders as the cathode material of MH Ni battery, which was aiming at improving the electrochemical behavior of the hydrogen storing alloy cathode, making the production of the MH Ni battery more cost effective, and decreasing the pollution. Thus the effects of the plating parameters including pH value and the concentrations of Cu^(2+) and additives on the electrochemical behavior of the H storing alloy powders were systematically investigated, based on the measurements of the cyclic voltammetric curves, the AC impedance, and the discharge curves. As the results, it was suggested to perform the optimized replacement Cu plating for each of 1 g H storing alloy with 25 mL H_2SO_4 etching solution of a concentration 0.01 mol/L and Cu^(2+)amount 0.05 g, at a pH value of 1.5～2.0 and additive concentration of 12 mg/L. The resulting copper coating prepared on the H storing alloy powders by properly controlling the plating process was uniform, fine, and bright, and was able to considerably improve the electrochemical behavior of the H storing alloy electrode.

关 键 词：置换镀铜 贮氢合金 电化学性能 

分 类 号：TQ153.1[化学工程—电化学工业]