Au-Ag-Si钎料薄带加工工艺的研究  

Study on Processing of the Au-Ag-Si Solder Ribbon

作　　者：莫文剑[1] 王志法[1] 崔大田[1] 

机构地区：[1]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《热加工工艺》2005年第1期19-20,共2页Hot Working Technology

基　　金：国家军工重点资助项目(DZ-2003-03)

摘　　要：根据Au-Ag-Si系三元相图制定了熔化温度在450～500℃的共晶钎料合金,针对该共晶合金的难加工性,对其加工工艺进行了研究。结果表明:采用二次熔炼铜模浇铸的铸锭方式可以获得均匀、细小的共晶组织;组织组成为α初晶+(α+β)共晶的亚共晶合金比α+β的共晶合金更有利于加工;采用先包覆Al热轧再进行冷轧结合中间退火的工艺可以制得厚度为0.1mm表面质量较好的钎料薄带。The eutectic alloy was instituted at 450～500℃ according to the Au-Ag-Si phase diagram. Aiming at the eutectic alloy′s undeformability, its making processs was studied.The results show that: secondary melting process and cooling in copper mould can achieve homogeneous fine microscopic structure. Deformability of α+(α+β) hypoeutectic alloy is better than eutectic alloy. 0.1mm solder ribbon having good surface quality can be achieve by the process of pack Al hot-rolling then cold-rolling combining with anneal.

关 键 词：Au-Ag-Si 钎料 加工工艺 包覆轧制 

分 类 号：TG146.3[一般工业技术—材料科学与工程]