脉冲电镀中阴极电流分布规律  

STUDY OF CATHODE CURRENT DISTRIBUTION IN PULSE PLATING

作　　者：向国朴[1] 陈高文[1] 邱训高[1] 

机构地区：[1]天津大学应用化学系

出　　处：《天津大学学报》1993年第5期76-81,共6页Journal of Tianjin University(Science and Technology)

摘　　要：基于简化的扩散模型,以金属分布近似代替电流分布,并用Wagner数作为评定标准,通过在平板电极和旋转圆盘电极上脉冲镀铜实验,详细研究了一次、二次和三次电流分布的影响。Based on a simplified diffusion model、with the approximation of metal distribution representing current distribution, and Wagner number as an evaluated standard experiments were made with pulse plating copper on plate electrode and rotating disk electrode, and the influence of pulsed current on primary, secondary and tertiary current distribution was investigated in detail in this paper.

关 键 词：脉冲电镀 阴极 电流分布 

分 类 号：TQ153[化学工程—电化学工业]