四氨基铜酞菁(CuTAPc)在金电极上成膜过程的研究  

Study on the Growth of Conducting CuTAPc on a Gold Electrode

作　　者：任春生[1] 张晓敏[1] 应敏[1,2] 

机构地区：[1]东华理工学院应用化学系 [2]浙江万里学院,浙江宁波315100

出　　处：《分析测试学报》2005年第1期1-7,共7页Journal of Instrumental Analysis

基　　金：宁波市重点博士基金资助项目 (02J20101-18)

摘　　要：采用循环伏安法和石英晶体微天平 (EQCM)技术对四氨基铜酞菁 (CuTAPc)在金电极上的聚合成膜过程进行了研究 ,讨论了扫描速度、溶剂、支持电解质及单体浓度对其成膜过程的影响 ,同时考察了该聚合膜分别在非水溶液和水溶液中的氧化还原行为及稳定性 ,其中借助EQCM重点讨论了在这些过程中溶液中的离子在膜中传输的机理。The electropolymerization of copper tetraaminophthalocyanine(CuTAPc)on a gold electrode has been studied by cyclic voltammetry and electrochemical quartz crystal microbalance(EQCM).The effects of various parameters on the polymer growth such as solvents,electrolytes,scan rates,and the CuTAPc concenˉtration etc,were examined.The redox characteristics and stability of the conducting film on repeating chargˉing and discharging were determined in aqueous and non-aqueous solutions.Particularly,the mechanism of ion transportation in these processes was discussed with the help of EQCM.

关 键 词：石英晶体微天平 循环伏安法 四氨基铜酞菁 成膜过程 离子传输 

分 类 号：O657.154[理学—分析化学]