印刷电路板差分线边缘布置的电磁兼容分析  

EMC analysis for the edge placement of differential lines on the printed circuit board

作　　者：袁智勇[1] 何金良[1] 陈水明[1] 

机构地区：[1]清华大学电机工程与应用电子技术系,北京100084

出　　处：《电波科学学报》2004年第6期689-693,共5页Chinese Journal of Radio Science

摘　　要：利用有限元法对差分信号线置于板子边缘的不同距离进行分析 ,得出差模阻抗和共模阻抗的变化 ,并且分析了散射参数 ,提取了系统的SPICE模型 ,分析了该边缘效应引起的共模噪声的变化以及造成的系统损耗 ,得出差分布线距离电路板的最小长度 ,并对差分布线的设计规则提供指导。The edge placement of the differential pair on the printed circuit is analyzed for electromagnetic using finite element method. The variation of common mode impedance and differential mode impedance is presented. The scatter parameters are analyzed and the total power loss is computed by the scatter parameters. SPICE model is extracted from S-parameter and common mode noise is analyzed by the SPICE simulation in time domain. The shortest distance from the edge is obtained in this paper.

关 键 词：差分线 边缘效应 特性阻抗 功率损耗 共模噪声 

分 类 号：TN81[电子电信—信息与通信工程]