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机构地区:[1]Key Lab. of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, South China Univ. of Technology, Guangzhou 510640, China [2]Inst. of Materials Chemistry and Eng., Kyushu Univ., Kasuga 816-8580, Japan
出 处:《Journal of Shanghai Jiaotong university(Science)》2004年第3期83-87,共5页上海交通大学学报(英文版)
摘 要:The present research is an experimental study on heat transfer characteristics of a natural circulation cooling system for electronic components. A smooth chip and two micro-pin-finned chips were tested. The chip is mounted on the base of a rectangular horizontal duct located at the bottom of 250 mm high natural circulation loop.FC-72 is used as a coolant. The test conditions are set that the operation pressure of experimental system is 1. 013× 105 Pa, the flow rate of FC-72 is 150 g/min and the subcoolings are 10 K, 25 K and 35 k, respectively. Effect of the subcooling on nucleate boiling and critical heat flux(CHF) were investigated. The results show that subcoolingis found to significantly affect CHF for all chips and micro-pin-finned chips sharply enhanced the boiling heat transfer, CHF of micro-pin-finned chips are 2.5~3 times as large as that of smooth chip at the same subcooling.The present research is an experimental study on heat transfer characteristics of a natural circulation cooling system for electronic components. A smooth chip and two micro-pin-finned chips were tested. The chip is mounted on the base of a rectangular horizontal duct located at the bottom of 250 mm high natural circulation loop. FC-72 is used as a coolant. The test conditions are set that the operation pressure of experimental system is 1.013×10 5 Pa, the flow rate of FC-72 is 150 g/min and the subcoolings are 10 K, 25 K and 35 k, respectively. Effect of the subcooling on nucleate boiling and critical heat flux(CHF) were investigated. The results show that subcooling is found to significantly affect CHF for all chips and micro-pin-finned chips sharply enhanced the boiling heat transfer, CHF of micro-pin-finned chips are 2.5~3 times as large as that of smooth chip at the same subcooling.
关 键 词:electronic component micro-pin-finned heat transfer enhancement
分 类 号:TN60[电子电信—电路与系统]
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