成型工艺对片式PTCR素坯及瓷片性能的影响  

Effects of forming process on the characteristics of green tape and chip ceramic of PTCR

作　　者：郑志平[1] 周东祥[1] 龚树萍[1] 刘欢[1] 胡云香[1] 

机构地区：[1]华中科技大学电子科学与技术系,湖北武汉430074

出　　处：《功能材料》2005年第2期252-255,共4页Journal of Functional Materials

基　　金：国家高技术研究发展计划(863计划)资助项目(2001AA325040)

摘　　要：将注凝成型、注浆成型与轧膜成型应用于片式PTCR的制备,研究了不同成型工艺对片式 PTCR素坯及瓷片性能的影响。研究发现,用注凝成型和注浆成型工艺制备的素坯比用轧膜成型更加均匀, 其陶瓷颗粒与粘结剂分布规则。在3种成型工艺所得的瓷片中,注凝成型瓷片晶粒生长最均匀,注浆成型瓷片晶粒生长较均匀,而轧膜成型瓷片晶粒生长不均匀。注凝成型和注浆成型工艺所制备瓷片的 PTC性能稍优于轧膜成型。瓷片的耐电压性能与成型工艺有较大的依赖关系。Gelcasting, slipcasting and roll forming were used to prepare chip PTCR in this paper, the effects of forming process on the characteristics of green tapes and ceramic samples were investigated. The results indicate that the green tapes and chip thermistors prepared by gelcasting and slipcasting were more uniform than those derived from roll forming. Among the three forming processes, gelcasting and slipcasting can obtain chip thermistors with better PTC effect. Furthermore, forming process has distinct impact on resisting electrical strength of chip thermistors.

关 键 词：成型工艺 片式PTCR 显微结构 电性能 

分 类 号：TQ174[化学工程—陶瓷工业]