连接温度对氮化硅陶瓷/镍基高温合金部分液相扩散连接接头性能的影响  

Effects of bonding temperature on the properties of silicon nitride ceramic/Ni based high temperature alloy partial liquid phase diffusion bonding joint

作　　者：杨敏[1] 邹增大[1] 王新洪[1] 王育福[1] 李春胜[1] 

机构地区：[1]山东大学材料科学与工程学院,山东济南250061

出　　处：《山东大学学报（工学版）》2005年第1期1-3,12,共4页Journal of Shandong University（Engineering Science）

基　　金：山东省自然科学基金资助项目 (Z2 0 0 0F0 2 ;Z2 0 0 2F0 3 )

摘　　要：采用部分液相扩散连接方法 ,利用Nb/Cu/Ni复合层作中间层 ,在连接压力、连接时间、冷却速度一定 ,连接温度变化的条件下对氮化硅陶瓷 /镍基高温合金进行了部分液相扩散连接试验 .通过剪切试验评价连接温度对接头强度的影响和采用SEM研究连接温度对接头微观组织的影响 ,分析了连接温度对氮化硅陶瓷Under the condition of fixed bonding pressure, time, cooling velocity and variable bonding temperature, the partial liquid phase diffusion bonding technology was employed to bond silicon nitride ceramic/Ni based high temperature alloy, with Nb/Cu/Ni multiplayer used as interlayer. Effect of bonding temperature on the strength of joint was evaluated by shear test. Influence of bonding temperature on the microstructure of joint was investigated by SEM. The experiment results show that the relationship between bonding temperature and of joint the shear strength obeys the parabolic law; Bonding temperature affects the molten volume of Cu, then, affects the microstructure of joint.

关 键 词：连接温度 部分液相扩散连接 氮化硅陶瓷 镍基高温合金 

分 类 号：TG454[金属学及工艺—焊接]