微型薄膜气敏元件芯片的传热系数和热功耗  

Thermal-power consumption and heat transfer coefficients in thin-film gas sensors

作　　者：邢建平[1] 袁庆华[2] 蔡成森[1] 李娟[1] 裘南畹[2] 

机构地区：[1]山东大学信息科学与工程学院,山东济南250100 [2]山东大学物理与微电子学院,山东济南250100

出　　处：《山东大学学报（工学版）》2005年第1期55-58,共4页Journal of Shandong University（Engineering Science）

摘　　要：热功耗是关系到气敏元件的应用、热特性分析和工艺设计的重要参数 ,至今无计算气敏薄膜元件热功耗的实用公式 ;在研究微型薄膜气敏元件引线的散热量 ,芯片传热系数随芯片尺寸和温度变化的规律的基础上 ,给出了热功耗的相关计算方法和公式 ,据此计算得出微型薄膜气敏元件的热功耗数值 。The thermal-power consumption is a key parameter of gas sensor,and it relates to the application, the thermal characteristic analysis and the technological design of gas sensor. As yet a practical approach or formula has not been proposed to calculate the thermal-power consumption in microtype thin-film gas sensor. In order to give out a formula or computmg method for the thermal-power consumption, the dissipating heat of lead-wires,the average temperatures of wire-mesh and underbed, the regularity for the heat transfer coefficients of sensor varying with size of heat transfer surface and working temperature were studied by the experiments. And for some thin-film gas sensors, the thermal-power consumption values calculated by using the formula consist with the experimental results.

关 键 词：薄膜 气敏元件 热功耗 传热系数 

分 类 号：TN305.94[电子电信—物理电子学]