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作 者:王继刚[1] 郭全贵[2] 刘朗[2] 白世鸿[3] 乔生儒[3]
机构地区:[1]东南大学材料科学与工程系 [2]中国科学院山西煤炭化学研究所,太原030001 [3]西北工业大学材料科学与工程系,西安710072
出 处:《材料工程》2004年第12期12-15,共4页Journal of Materials Engineering
基 金:国家自然科学基金资助项目(50303004);江苏省自然科学基金资助项目(BK2004409);东南大学优秀青年教师教学;科研资助计划(4012001003)
摘 要:以酚醛树脂为基体,以碳化硼(B4C)粉末为改性填料制备高温胶粘剂,并对碳材料进行粘接。粘接样品在200℃固化后,随即在马弗炉中进行1200℃的高温处理。在1000,1400,1800℃测试粘接样品的高温粘接性能。结果表明,改性酚醛树脂具有较好的高温粘接性能,且随着测试温度的提高,粘接样品的粘接强度随之提高。高温下改性组分结构、形态的变化对酚醛树脂的高温粘接性能有着重要的影响。适量B2O3的形成有利于在粘接界面处形成化学键合力,从而提高界面粘接能力;但B2O3在高温下熔融并呈现为玻璃相,致使破坏应力迅速扩展延伸,从而引起高温环境下粘接强度的迅速降低。随着温度的升高,B2O3玻璃相在粘接胶层中的含量逐渐减少,对高温粘接性能的影响降低,粘接制品的高温粘接性能随之提高,1800℃测试温度下的粘接强度达到5.The high temperature adhesive was prepared using phenol-formaldehyde resin as matrix and boron carbide as additives. Carbon materials were bonded by the above adhesive and thermally cured at 200°C previously. Subsequently, the bonded specimens were heat-treated at 1200°C in Muffle furnace. The high temperature bonding properties was tested at 1000°C, 1400°C and 1800°C respectively. The results showed that the modified phenol-formaldehyde resin exhibited satisfactory high temperature bonding properties. With the elevated testing temperatures, the bonding strength of bonded specimens was also increased. When the testing temperature reached 1800°C, the bonding strength was 5.22 MPa. The change of structure and morphology of modification component had great effect on the high temperature bonding properties of phenol-formaldehyde resin. The properly production of B2O3 benefited in the formation of chemical bonding force at bonding interface and resulted in the increase of adhesive ability. But B2O3 would melt and converted into glass phase at high temperature environments and resulted in the extending of failure force quickly and decreasing of high temperature bonding properties. With the elevated high temperatures, the content of B2O3 was reduced, so the high temperature joining strength was increased gradually.
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