Ti微测辐射热计关键技术分析  

Key Techniques of Titanium Microbolometer

作　　者：刘爽[1] 杨亚培[1] 刘永智[1] 李华高[2] 

机构地区：[1]电子科技大学光电信息学院,四川成都610054 [2]重庆光电技术研究所,重庆400060

出　　处：《半导体光电》2005年第1期10-13,共4页Semiconductor Optoelectronics

基　　金：电子科技大学青年基金资助课题.

摘　　要：Ti微测辐射热计具有高电阻温度系数、低噪声和与 IC工艺兼容性好等特点,在非致冷红外图像系统等应用领域越来越受到关注。文章通过理论分析指出,降低热导、提高填充因子和降低噪声是该种器件形成和使用中的关键技术,给出了相关技术的研究状况。Titanium microbolometer is received great attention in uncooled infrared imaging system applications, because it has a relatively high temperature coefficient of resistance(TCR), low noise characteristics, and is compatible with IC processes. As key techniques for forming and using titanium microbolometer, low thermal conductance, high fill-factor and low noise are brought forward by theoretical analysis, and the recent research status in this field is also reviewed.

关 键 词：非致冷红外探测 Ti微测辐射热计 热导 填充因子 噪声 

分 类 号：TN215[电子电信—物理电子学]