酸性氯化铜蚀刻液与碱性氯化铜蚀刻液比较  

Cupric Chloride Etehant Compare with Alkaline Ammonia Etchant

作　　者：辰光 

机构地区：[1]台光电子材料(昆山)有限公司,235100

出　　处：《印制电路信息》2003年第9期38-38,57,共2页Printed Circuit Information

摘　　要：本文针对酸性氯化铜蚀刻液与碱性氯化铜蚀刻液的组成本性计算方面作一简单的对比,为业界同仁提供一 个参考方向,对新手或行外人士以启迪,有事半功倍之受用。The article is a sigle compare in component,natural character and count of the cupric chloride etchent and the alkaline ammonia etchent,which is reference for the people of the same profession and the enlightenment and the benefit getting twice the result with half the effort for the people who are new hand and ignoramus.

关 键 词：酸性氯化铜 蚀刻液 碱性氯化铜 成分 性能 蚀刻速度 废液处理 印制电路板 

分 类 号：TN305.7[电子电信—物理电子学]