磷酸铜无机胶套接强度的探讨  

The Sheath Interlink Strength Research for Copper Phosphate Adhesive

作　　者：陶导先[1] 李壮[1] 许积札 郭献忠 盛静 李文军[1] 金毅[1] 

机构地区：[1]北京科技大学化学系

出　　处：《粘接》1993年第1期9-12,17,共5页Adhesion

摘　　要：——用热澎胀仅测定磷酸铜无机胶和加入10％的Al_2O_3、Cr_2O_3填料的两种磷酸铜无机胶的线膨胀系数。得出常温至720℃条件下,无机胶主要倾向是体积收缩。对照差热—热重曲线,得出了磷酸铜无机胶套接强度高的原因是在粘接过程中形成的化学键力、分子间力和机械咬合作用。The linear expansion coefficient of two kinds of inorganic adhesives, copper phosphate adhesive and the same adhesive added 10% Al_2O_3, Cr_2O_3 as filler has been measured with thermo-expansion device. It has been found that the main tendency of inorganic adhesives from ambient temperature to 720℃ was volume contraction, compared with DTA-TG curve, it was found that the high sheath interink strength of copper phosphate resulted from the force of chemical bond, interacting molecule and mechanical interlink formed in adhering processing. Some information can be found in this thesis for higher adhesive strength of copper phosphate adhesive.

关 键 词：磷酸铜 热收缩 粘接强度 胶粘剂 

分 类 号：TQ433.51[化学工程]