用X射线光电子谱(XPS)法研究粘接配位键机理  

Study on the Mechanism of the Adhesin Co-ordinate Bond by X-ray Photoelectron Spectroscopy

作　　者：翟海潮[1] 翁熙祥[1] 

机构地区：[1]装甲兵工程学院,北京市丰台区100072

出　　处：《粘接》1993年第6期17-21,共5页Adhesion

摘　　要：本文用X射线光电子谱(XPS)法对环氧胶和被粘物(钢和氧化铝)粘接界面各元素的化学状态进行了研究。结果表明:界面处元素N、O、Fe、Al发生了化学位移,从而证实了粘接界面配位键的存在。In this paper, the chemical state of some elements on adhesive (epoxy) -ad- herend (steel or Al_2O_2) interface was inves- tigated by X-ray photoelectron spec- troscopy. The results show that the dis- placement thus the adhesion co-ate ordinate bond existing on the interface was proved.

关 键 词：XPS 粘接理论 配位键机理 

分 类 号：TG491[金属学及工艺—焊接]