脉冲电镀Ni－Co合金的研究  

Study of Ni Co Alloy Pulse-Plating

作　　者：向国朴[1] 周恩彪 

机构地区：[1]天津大学应用化学系

出　　处：《电镀与涂饰》1994年第2期18-22,共5页Electroplating & Finishing

摘　　要：研究了脉冲参数对电沉积Ｎｉ－Ｃｏ合金镀层的钴含量与硬度的影响。确定了最佳的脉冲参数。应用Ｘ射线和扫描电镜分析了Ｎｉ－ＣＯ合金镀层的结构和形貌。比较了脉冲电流（ＰＣ）和直流电流（ＤＣ）电镀Ｎｉ－Ｃｏ合金镀层的各种性能。Current parameters for pulse plating of Ni-Co alloy were optimized through investigation of their effects on the hardness of and the cobalt content in the obtained deposit. Morphology of the deposits wasexamined by X-ray diffraction and SEM. Comparison of properties was made between the Ni-Co deposits obtained from pulse plating bath andthose from traditional direct current plating bath.

关 键 词：电镀 镀合金 脉冲电镀 

分 类 号：TQ153.18[化学工程—电化学工业]